Sennheiser XSW 2-ME3-A Wireless Cardiod Headset Microphone for Singers, Presenters and Live Sound,House of Worship, Conference Rooms and Flute Instrument

Description

Achieve absolute flexibility and dynamic vocal isolation on stage with the genuine Sennheiser XSW 2-ME3-A Wireless Cardioid Headset Microphone System. Built specifically for vocalists, trainers, stage speakers, and wind instrument performers who require a rock-solid hands-free configuration, this upgraded XS Wireless 2 system features an intuitive LCD interface layout for more manual tuning parameters and enhanced RF stability under demanding live conditions.

• Premium Cardioid ME 3-II Headmic: Lightweight, ergonomically balanced headset microphone houses a permanently polarized condenser capsule featuring a precise cardioid polar pattern to isolate your speech or flute audio while aggressively rejecting ambient room echo and feedback loop structures.
• True Diversity Metal Receiver Architecture: The upgraded EM-XSW 2 receiver is encased in a premium metal housing layout and features two external BNC antennas to dynamically select the strongest tracking frequency, eliminating signal dropouts entirely.
• Expanded Multi-Channel Capacity: Grows easily alongside your studio or venue configuration by offering up to 12 compatible channels spread over 8 factory frequency banks within a stable, wide-bandwidth UHF range (A-Band: 548-572 MHz).
• Automatic Setup & Manual Control: Delivers zero-stress deployment via an integrated environment scanner and a one-touch remote synchronization channel function, paired with an enhanced manual LCD menu configuration screen.
• Pro Rackmount Hardware Included: Fully packaged for standard commercial A/V rack integration or control booths, arriving bundled with a heavy-duty rackmount frame, an NT 12-5 CW power supply, a storage pouch, and standard AA batteries.
• Official Brand Warranty: Backed by a standard 2-Year Official Manufacturer Warranty valid throughout India. Covered strictly for wireless transmission circuit synchronization dropouts, internal driver board breakdowns, component tracking flaws, and material defects from the purchase invoice date.